Samtec announces the opening of an interconnect design and development center in the Chicago, IL suburb of Lisle. This office is a critical element of Samtec’s future product development and technology roadmap, and recruitment for staff at this new facility is rapidly underway.
Selected for its central location and impressive electromechanical local talent pool, the Chicagoland office will join that ranks of Samtec’s Silicon Valley Optics Design Center, Pacific Northwest High Speed Cable Plant, Microelectronics Group in Colorado Springs, Advanced Interconnect Design Groups located on three continents, and Signal Integrity Group and Teraspeed Consulting in the northeast US. Skillsets spanning all of these areas of expertise are being sought for the Chicagoland office, to build a truly cross-functional and integrated team. Together, these technology centers develop products and services that address full-system challenges and offer strategic support at every level. The Chicagoland office, which is looking to immediately staff Product Design Engineers, Manufacturing Engineers, Signal Integrity Engineers, and an Engineering Manager, will be central to this effort in more than the geographic sense.
Founded in 1976, Samtec is a privately held, $626 million global manufacturers of a broad line of electronic interconnect solution blocks, including IC-to-Board/Ultra Micro, High Speed Board-to-Board, High Speed Cables, Future-Proof/Active Optics, Flexible Stacking, and Micro/Rugged components and cables. To meet the interconnect challenges of tomorrow and beyond, Samtec has developed unique Technology Centers to help optimize the entire signal transmission path… from the IC to the panel and beyond, and all points in between.